MiniPIX TPX3 camera is miniaturized and low power radiation camera with the state of art Timepix3 chip. The Timepix3 is the CERN's latest pixel detector chip that records position, energy and time for every detected quantum of radiation.
MiniPIX TPX3 makes fully spectral X-ray imaging easy as it records spectrum of measured X-ray in each pixel. The camera can be therefore used in a variety of applications, such as spectral X-ray imaging (X-ray fluorescence imaging, X-ray radiography in low flux). Combined angular and energy dispersive XRD, SAXS or WAXS are possible. The X-ray diffraction is revolutionised by this device as it eliminates the need of monochromator. It simplifies the X-ray diffraction, SAXS and WAXS experiments and extends the applicability of these methods without need of access to synchrotrons. Other applications of this device are spectral gamma ray imaging (scintigraphy, SPECT, radiography with isotopes). Thanks to the possibility to measure energy, position and time, the device is capable of digitally registering shapes tracks of ionising particles. Online continuous ionising particle tracking is therefore very easy and this information can serve for radiation monitoring (particle type sorting, spectroscopy, directional sensitivity, etc) or it can be used as a gamma camera or a Compton camera. The latter is possible with special software tools developed by Advacam for the image reconstruction.
The Timepix3 detector has a fast, sparse data readout where each detected particle or photon is either read-out immediately (pixel mode) at maximum rate of 2.35 million hit pixels per second or accumulated in pair of images (frame mode). The frames are read-out at a speed of 16 frames per second. The device connects to computer via USB2.0 interface with standard µUSB connector.
All major operating systems are supported (MS Windows, Mac OS and LINUX). The PIXET PRO software used for detector operation is provided for free. Extra software modules are available for special functions (e.g. coded aperture image reconstruction, Compton camera image and spectrum reconstruction, radiation field decomposition, networking of many devices, etc).
- Non-Destructive Testing
- X-ray diffraction
- Other applications
|Sensor Material:||Si or CdTe|
|Sensor Thickness:||100 μm, 300 μm and 500 μm for Si; 1 mm for CdTe|
|Sensitive Area:||14 mm x 14 mm|
|Time Resolution:||1.6 ns|
|Readout Speed:||2.35 million hits/s|
|Frame rate:||16 fps|
|Number of Pixels:||256 x 256|
|Pixel Pitch:||55 μm|
|Energy Resolution:||0.5-1 keV (Si) and 1.1-3.6 (CdTe)|
|Min. Detectable Energy:||3 keV (Si) and 5 keV (CdTe)|
|Pixel Mode of Operation:||Time-over-Threshold, Time-of -Arrival|
|Dimensions:||80 mm x 21 mm x 14 mm (L x W x H)|